USB 3.0

Intel announced that is working with a team of companies for the production of High Speed door USB, 10 times faster than the actual generation of USB 2.0.
USB 3.0 Promoter Group, that is constituted by Intel, HP, NEC Corporation, NXP Semiconductors, Microsoft and Texas Instruments, draws also other important changes. Beyond raising the speed, has been received seriously the energy consumption but also the more general attribution of protocol. USB 3.0 will use the same architecture of wiring, but was not announced further details. “To USB 3.0 is the reasonable next step for the most popular means of interconnection”, declared Jeff Ravencraft, analyst of technological strategy and chairman of USB Implementers Forum. The final specifications of USB 3.0 will become acquaintances at some time in the first half-year period 2008.